With dual sided top-down and bottom up viewing sensors, the LX-1000 inspects solder joints and verifies correct part assembly, enabling users to improve quality and enhance yields.

Advanced 2D and 3D sensors and newly available image processing technology integrates several techniques, including fringe projection, color inspection, normalised correlation and rule-based algorithms, to provide complete inspection metrology with an unmatched low false failure rate. Programming the LX-1000 is fast and intuitive. Operators typically take less than 60 minutes to create a complete inspection program including solder inspection. The LX-1000 utilises a standard package library to simplify training and ensure program portability across manufacturing lines. The LX-1000 is highly effective for selective solder, post wave and connector inspections. Off-line programming maximises machine utilisation and real-time SPC monitoring provides a valuable yield enhancement solution.

 Single or dual sided imaging with full travel imaging sensors

630mm x 630mm large inspection area

Optional 3D and/or 2D automated inspection

Up to 100 mm clearance

Heavy duty conveyor options for samples to 15kg

High defect coverage / low false failure

MES / Industry 4.0 compatible

Automated Inspection for:

THT component and solder defects

SMT component presence and position

Wave / Selective solder joint inspection

Correct part / polarity

Configurable for automated conformal

coat inspection (ACI)