The MatriX X3# is an automated inspection system designed for sophisticated high-speed inspection in SMT production.
Transmission X-ray Technology with patented Slice-Filter-Technique (SFT), Off-Axis technology and 3D SART present a reliable solution for the in-line inspection of double-sided PCB assemblies. The X3# movable detector axes allow high-speed off-axis image acquisition from different angles and directions with maximum image quality and resolution.
X-ray System Features:
Flexible Inline AXI system
3-axes programmable motion system with variable FOV
Maintenace free sealed tube and digital flatpanel technology
In-line pass through board handling with automatic width adjust
Automatic grey-level and geometrical calibration
Full product traceability via customized MES-Interface (incl. 1D/2D barocescan)
Optional: Combination with MatriX AOI module
Inspection speed
Transmission (2D): 3-4 images/sec
Microfocus X-ray source (sealed)
standard:
130kV/40W
optional:
100KV/20W
120kV/40W
Detector
standard:
CMOS Flatpanel Detector
(14 bit, 1,5k x 1,5k, 75 µm)
optional:
CMOS Flatpanel Detector
(14 bit, 1k x 1k, 75 µm)
CMOS Flatpanel Detector
(14 bit, 2,3k x 2,3k, 50 µm)
TDI Line Scan
(12 bit, 2-4k, 48-96 µm)
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