Nordson YESTECH Ultra 3D

High-speed PCB inspection with exceptional defect coverage.

Nordson YESTECH’s advanced 3D imaging technology offers high-speed PCB inspection with exceptional defect coverage. With one top down viewing camera, four side viewing cameras and 2D + 3D inspection, the FX-940 ULTRA inspects solder joints and verifies correct part assembly enabling users to improve quality and increase throughput.

Automated In-line 3D AOI System PCB Inspection.

5 axis 3D NYT VISION Technology

Advanced 2D + 3D inspection

Multi-fringe digital projection

1 top-down and 4 side viewing cameras

Automatic programming tools: < 30 minutes

High defect coverage / low false failure

PC data collection & reporting

Programming the FX-940 ULTRA is fast and intuitive. Operators typically take less than 30 minutes to create a complete inspection program including solder and lead inspections. The FX-940 ULTRA utilizes a standard package library to simplify training and ensure program portability across manufacturing lines.

Advanced LED lighting and newly available image processing technology integrates several techniques, including 3D inspection, color inspection, normalized correlation and rule-based

algorithms, to provide complete inspection coverage with an unmatched low false failure rate.

Configurable for all line positions, the FX-940 ULTRA is equally effective for paste, pre / post-reflow and final assembly inspection. Off-line programming maximizes machine utilization and real-time SPC monitoring provides a valuable yield enhancement solution.

Download the YESTECH Ultra 3D Datasheet