Nordson YESTECH’s advanced multi-purpose, large area,
double-sided inspection system offers high speed PCB inspection
with exceptional defect coverage.
With dual sided top-down
and bottom up viewing sensors, the LX-1000 inspects solder
joints and verifies correct part assembly, enabling users to
improve quality and enhance yields.
Advanced 2D and 3D sensors and newly available image
processing technology integrates several techniques, including
fringe projection, color inspection, normalised correlation and
rule-based algorithms, to provide complete inspection metrology
with an unmatched low false failure rate.
Programming the LX-1000 is fast and intuitive. Operators
typically take less than 60 minutes to create a complete inspection
program including solder inspection. The LX-1000 utilises a
standard package library to simplify training and ensure program
portability across manufacturing lines.
The LX-1000 is highly effective for selective solder, post wave
and connector inspections. Off-line programming maximises
machine utilisation and real-time SPC monitoring provides a
valuable yield enhancement solution.
Features:
Single or dual sided imaging with full travel imaging sensors