YESTech's advanced Thin Camera technology offers high-speed PCB inspection with exceptional defect coverage. With up to four top - down viewing cameras and four side viewing cameras, the YTV inspects solder joints and verifies correct part assembly enabling users to improve quality and increase throughput.
Programming the YTV is fast and intuitive. Operators typically take less than 30 minutes to create a complete inspection program including solder inspection. The YTV utilizes a standard package library to simplify training and insure program portability across manufacturing lines.
Newly available image processing technology integrates several techniques, including color, template matching and rule-based algorithms, to provide complete inspection coverage with an extremely low false failure rate.
Configurable for all line positions, the YTV is equally effective for paste, pre / post-reflow or final assembly inspection. Off-line programming maximizes machine utilization and real-time SPC monitoring provides a valuable yield enhancement solution. |
|

F1 In-Line, Multi Camera AOI |