YTX 3000 High Resolution X-Ray system		YTX X1 In-Line X ray
The YTX-3000 x-ray system offers EMS providers and semiconductor packagers a superior yield enhancement solution to reduce costs, improve quality and increase throughput. The YESTech YTX-3000 provides users with a high-resolution x-ray capability in a flexible, compact maintenance free configuration. The YTX-3000 is available with a 4 or 5 axis sample manipulator and a 15" x 20" (380mm x 508mm) x-y travel for samples up to 5 pounds in weight. Full 360 degrees of rotation and 30 degrees of tilt are available. Stepper motor drives provide a wide range of motion from ultra-slow use at high magnifications, to high speed for travel over large distances. All systems come with a unique control module and programmable motion for automated inspection.   The YTX-3000 comes with YESTech's proprietary machine vision technology for fully automated inspection of BGA and flip chip devices. Other optional inspections include die attach, bond wire and correct assembly verification.		YESTech’s versatile X1 Automated X-Ray InspectionSystem ( AXI ) offers complete inspection of solderjoints and other critical hidden features found in electronic assemblies, PCB’s and packaged semiconductors. Ideal for in-line or off-line operation, the X1’s proven algorithms enable fastand reliable automated inspection and real-time monitoring of critical process information. Programming the X1 is fast and intuitive. Operators typically take less than 30 minutes to create a complete inspection program. The X1 utilizes a standard package library to simplify training and insure program portability across manufacturing lines. Newly available image processing technology integrates several techniques and inspection algorithms to provide complete inspection coverage with an extremely low false failure rate. The YESTech X1 Automated X-Ray system is an effective inspection tool for ball grid array devices, components undershields and complex high density boards. When integratedwith YESTech AOI systems, the X1 can increase fault coverageto include nearly all process defects. Optional remote programming and SPC software can be utilized to provide a comprehensive yield enhancement solution.